国家自然科学基金(61574163)
江苏省杰出青年基金(BK20170008)
江苏省六大人才高峰(DZXX-082)
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Figure 1
(Color online) Schematic of self-healing mechanism of polymers
Figure 2
(Color online) Schematic of self-healing of conductive material/polymer composites: (a) Schematic of self-healing via embedding liquid conductive materials capsules
Figure 3
(Color online) Self-healing piezoresistive force sensor based on $\mu$Ni/L composite
Figure 4
(Color online) Real-time monitoring of human motions using the superelastic strain sensor based on self-healing SWNT/PVA-borax hydrogel composite
Figure 5
(Color online) Self-healing piezoresistive stress/strain sensor based on conductive polymer
Figure 6
(Color online) SWNT/L composite
Figure 7
(Color online) Self-healable flexible gas sensor based on MWNT/PEM composite film
Figure 8
(Color online) Self-healing flexible multifunctional sensor
Figure 9
(Color online) The overall experimental strategy relating to the flexible self-healable multifunctional sensor for human health monitoring application
Material | Mechanical | Healing | Healing | Healing | Ref. |
strength | mechanism | condition | efficiency (% | ||
3M4F | 121 MPa/ | Thermal reversible | 120${^\circ}$C$\sim$150${^\circ}$C | 41$\sim$50 | [34] |
Compression | DA reaction | (N$_{2})$/2 h$~\to~$RT | |||
2MEP4F | 121 MPa/ | Thermal reversible | 115${^\circ}$C/30 min | 80 | [35] |
Compression | DA reaction | $\to~$40${^\circ}$C/6 h | |||
DCPD based | 85 MPa/par Compression | Thermal reversible | 120${^\circ}$C(Ar)/20 h | 46 | [36] |
polymer | DA reaction | ||||
Epoxy based par rubber | 0.5 MPa/par Stretch | Disulfide bond | 60${^\circ}$C/1 h | 95 | [41] |
PU rubber | 3.9 MPa/par Stretch | Disulfide bond | Visible light/ 24 h | 97 | [42] |
Ru/PBD | 0.4 MPa/par Stretch | C-C double bond | 20 kPa/1 h | 100 | [47] |
CF/polyimine | 140 MPa/par Bending | Imine bond | 121${^\circ}$C/45 MPa | 100 | [46] |
M1-TEGMEMA | – | Acylhydrazone bond | 100${^\circ}$C/24 h | 100 | [44] |
Fatty acid based SR | 2 MPa/par Stretch | Hydrogen bond | RT/3 h | 100 | [50] |
PDMS-COOH$_{2}$ par based SR | 0.4 MPa/par Stretch | Hydrogen bond | 80${^\circ}$C/16 h | 100 | [53] |
a) 3M (maleimide monomor); 4F (furan monomer); RT (room temperature); 2MEP (1, 8-Bis(maleimido)-1-ethylpropane); DCPD (dicyclopentadiene); PU (polyurethane); PBD (polybutadiene); CF (carbon fiber); M1 (acylhydrazone monomer); TEGMEMA (triethylene glycol methylether methacrylate); SR (supermolecular rubber); PDMS (polydimethylsiloxane oligomers); COOH (carboxyl)
Material | Healing par mechanism | Healing condition/par efficiency | Application | Ref. |
MDPB-TDF/ S-CCTO | Self-healing of SWNT | 105${^\circ}$C/30 min: | Capacitive | [13] |
driven by thermal | electrical$\sim~$89%; | force sensor | ||
reversible DA reaction | mechanical$\sim~$86% | |||
$\mu~$Ni/L | Hydrogen bond | 50 kPa/15 s: electrical$\sim~$90% | Piezoresistive | [14] |
50${^\circ}$C/10 min: mechanical$\sim~$100% | force sensor | |||
rGO/PBS | B-O dative bond & | RT/10 min: par electrical$\sim~$90%; | Piezoresistive | [26] |
hydrogen bond | mechanical$\sim~$80% | force sensor | ||
SWNT/ PVA-borax | Hydrogen bond | RT/3.2 s: electrical$\sim~$98% | Piezoresistive | [78] |
force sensor | ||||
m-PCL/GO/ AgNWs | Hydrogen bond | 80${^\circ}$C/3 min: par electrical$\sim~$80%; | Piezoresistive | [79] |
mechanical$\sim~$100% | force sensor | |||
CNT-Fe$^{3~+~}$/PDA@ENR | Metal coordination bond | RT/24 h: par electrical$\sim~$100%; | Piezoresistive | [80] |
mechanical$\sim~$89.3% | force sensor | |||
CNTs@(PEI@CNC)/ | Hydrogen bond | Hot-press: par electrical$\sim~$100%; | piezoresistive | [81] |
XNBR | mechanical$\sim~$83% | force sensor | ||
C-CNC@GA@Ca$^{2+}$ | Hydrogen & | RT/30 s: par electrical$\sim~$100%; | Piezoresistive | [82] |
@CNTs/ENR | metal coordination bond | mechanical$\sim~$90% | force sensor | |
C-CNC@CT@CNTs/ENR | Hydrogen bond | RT/15 s: par electrical$\sim~$100%; | Piezoresistive par | [83] |
mechanical$\sim~$100% | force sensor | |||
Amylopectin par hydrogel | Hydrogen bond | RT/3 s: electrical$\sim~$99.3%; | Piezoresistive | [84] |
RT/5 min: mechanical$\sim~$98.4% | force sensor | |||
PVA-PEDOT: PSS | Hydrogen bond | 80${^\circ}$C $\to~-$20${^\circ}$C: par electrical$\sim~$100%; | Piezoresistive | [85] |
mechanical$\sim~$85% | force sensor | |||
PVA-PVP/CNC-Fe$^{3~+~}$ | Ionic coordination bond | RT/5 min: par electrical$\sim~$100%; | Piezoresistive | [86] |
mechanical$\sim~$100% | force sensor | |||
Thermal-reversibleg | 90${^\circ}$C/20 min: par electrical$\sim~$99.2%; | Piezoresistive | [87] | |
$\kappa~$-carrageenan | mechanical$\sim~$100% | force sensor | ||
PEG-PAA | Metal coordination & | RT/2 h: electrical $\sim~$100% par RT/12 h: | Piezoresistive | [88] |
Hydrogen bond | mechanical$\sim~$96.8% | force sensor | ||
PANI-PAA-PA | Hydrogen bond & | Slight pressure/24 h: electrical$\sim~$99%; | Piezoresistive | [89] |
electrostatic interaction | mechanical$\sim~$99% | force sensor | ||
Graphene/PU | Thermal reversible | Microwave/5 min$~\to~$65${^\circ}$C/5 h: par | Piezoresistive | [90] |
DA reaction | electrical$\sim~$75%; mechanical$\sim~$100% | force sensor | ||
PAA-Fe$^{3~+~}$/DCh-PPy | Ionic interaction | RT/1 min: electrical$\sim~$96% par | Piezoresistive | [15] |
RT/2 min: mechanical$\sim~$100% | force sensor | |||
PDMAA-PVA/rGO | Hydrogen bond | RT/12 h: par electrical$\sim~$89.6%; | Piezoresistive | [25] |
mechanical$\sim~$100% | force sensor | |||
SWNT/L | Hydrogen bond | RT/1 h: electrical$\sim~$100% | Temperature sensor | [91] |
P(BMA-co-LMA)/MWNT | C-C double cond | 60${^\circ}$C/3 h: par electrical$\sim~$98%; | Temperature sensor | [92] |
mechanical$\sim~$94% | ||||
MWNT/PEM | Hydrogen bond & | Water/30 min: par electrical $\sim~$91%; | Gas sensor | [21] |
electrostatic interaction | mechanical$\sim~$100% |
a) S-CCTO (surface-modified CaCu3Ti4O12); MDPB (1, 1'-(methylene di-4, 1-phenylene) bismaleimide); TDF (2, 2'-(Thiodimethylene) difuran); PBS (polyborosiloxane); PVA (polyvinyl alcohol); m-PCL (poly( 3-caprolactone) microspheres); PDA (polydopamine); ENR (epoxidized natural rubber); PEI (polyethyleneimine); C-CNC (carboxyl cellulose nanocrystals); XNBR (carboxylated nitrile rubber); GA (gelatin); CT (chitosan); PEDOT:PSS (poly(3, 4-ethylenedioxythiophene):polystryrene sulfonate); PVP (polyvinyl pyrrolidone); PAAm (polyacrylamide); PEG (polyethylene glycol); PAA (poly(acrylic acid)); PANI (polyaniline); PA (phytic acid); DCh (double-bond decorated chitosan); PPy (polypyrrole); PDMAA (poly(N, N-dimethylacrylamide)); P(BMA-co-LMA) (poly(butyl methacrylate-co-lauryl methacrylate)); PEM (polyelectrolyte multilayer)