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SCIENTIA SINICA Informationis, Volume 47 , Issue 2 : 260-274(2017) https://doi.org/10.1360/N112016-00081

Prebond through silicon vias test based on time-to-digital conversion}{Prebond through silicon vias test based on time-to-digital conversion

More info
  • ReceivedJun 20, 2016
  • AcceptedAug 16, 2016
  • PublishedDec 14, 2016

Abstract


Funded by

国家自然科学基金(61274036)

国家自然科学基金(61371025)

国家自然科学基金(61474036)

国家自然科学基金(61540011)

国家自然科学基金(31601224)

安徽省高校省级自然科学研究重点项目(KJ2016A001)

安徽省高校省级自然科学研究重点项目(KJ2016A006)

安徽省高校省级自然科学研究重点项目(KJ2014A005)

安徽省自然科学基金青年项目(1608085QF145)


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