SCIENCE CHINA Information Sciences, Volume 64 , Issue 11 : 219404(2021) https://doi.org/10.1007/s11432-020-3140-4

A physics-based electromigration reliability model for interconnects lifetime prediction

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  • ReceivedOct 21, 2020
  • AcceptedDec 14, 2020
  • PublishedOct 12, 2021


There is no abstract available for this article.


This work was supported by National Natural Science Foundation of China (Grant No. 61674008) and National Key Research and Development (Grant No. 2016YFA0202101).


Appendix A.


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  • Figure 1

    (Color online) (a) Physics-based EM reliability model of interconnects, which accounts for the process of resistance evolution; (b) modeling resistance evolution in comparison of experimental data [5]; (c) EM lifetime prediction with different operation current densities; (d) EM lifetime in pulse operation with different duty cycles.


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